Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument

ABSTRACT

A method of manufacturing a mask includes: attaching a second substrate having a plurality of penetrating holes to a first substrate having an opening. The second substrate is attached such that the penetrating holes are positioned within the opening. A groove is formed on a surface of the first substrate facing the second substrate. The groove is utilized to form a flow path between the first and second substrates.

This is a continuation of U.S. application Ser. No. 10/247,360 filed onSep. 20, 2002 now U.S. Pat. No. 6,720,236.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to a mask and its manufacturing method, anelectro-luminescence device and its manufacturing method, and anelectronic instrument.

2. Description of Related Art

A mask with high precision is required. For example, a method ofmanufacturing a color organic electro-luminescence (EL) device that isknown uses a mask to deposit an organic material of each color. Sincedeposition is performed under the high temperature, it is preferable tocool the mask. In a conventional method, a component for holding themask is cooled, but it is desirable to further improve the coolingefficiency.

SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provideda method of manufacturing a mask comprising:

-   -   attaching to a first substrate having an opening a second        substrate having a plurality of penetrating holes such that the        penetrating holes are positioned within the opening;    -   forming a groove on at least one of a surface of the first        substrate facing the second substrate and a surface of the        second substrate facing the first substrate; and    -   utilizing the groove to form a flow path between the first and        second substrates.

According to a second aspect of the present invention, there is provideda mask comprising:

-   -   a first substrate having an opening; and    -   a second substrate attached to the first substrate and having a        plurality of penetrating holes, wherein:    -   the second substrate is attached to the first substrate such        that the penetrating holes are positioned within the opening;    -   a groove is formed on at least one of a surface of the first        substrate facing the second substrate and a surface of the        second substrate facing the first substrate; and    -   the groove is utilized to form a flow path between the first and        second substrates.

A method of manufacturing an EL device according to a third aspect ofthe present invention comprising:

-   -   forming a film of a light emitting material using the mask as        defined in claim 9; and    -   cooling the mask by causing a fluid to flow through the flow        path of the mask, in the step of forming a film of a light        emitting material.

An EL device according to a fourth aspect of the present invention ismanufactured by the above method.

An electronic instrument according to a fifth aspect of the presentinvention has the above EL device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are views illustrative of a mask according to oneembodiment of the present invention.

FIG. 2 is a partially enlarged sectional view taken along the II—II lineof FIG. 1A.

FIG. 3 is a partially enlarged sectional view taken along the III—IIIline of FIG. 1A.

FIG. 4 is a partially enlarged sectional view taken along the IV—IV lineof FIG. 1A.

FIG. 5 is an exploded view of a mask in accordance with one embodimentof the present invention.

FIG. 6 is a view for describing a manufacturing method of a maskaccording to one embodiment of the present invention.

FIG. 7 is a view for describing a manufacturing method of a maskaccording to one embodiment of the present invention.

FIG. 8 is a view for describing a manufacturing method of a maskaccording to one embodiment of the present invention.

FIGS. 9A and 9B show a modification of one embodiment of the presentinvention.

FIG. 10 is a view for describing the manufacturing method of a mask andan EL device in accordance with one embodiment of the present invention.

FIGS. 11A to 11C are views for describing a method of forming a film ofa light emitting material.

FIG. 12 is a view showing an EL device manufactured by utilizing themethod of forming a film of a light emitting material using a mask inaccordance with one embodiment of the present invention.

FIG. 13 is a view showing an electronic instrument in accordance withone embodiment of the present invention.

FIG. 14 is a view showing an electronic instrument in accordance withone embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Embodiments of the present invention may provide a mask which can beeffectively cooled and its manufacturing method, an EL device and itsmanufacturing method, and an electronic instrument.

(1) According to one embodiment of the present invention, there isprovided a method of manufacturing a mask comprising:

-   -   attaching to a first substrate having an opening a second        substrate having a plurality of penetrating holes such that the        penetrating holes are positioned within the opening;    -   forming a groove on at least one of a surface of the first        substrate facing the second substrate and a surface of the        second substrate facing the first substrate; and    -   utilizing the groove to form a flow path between the first and        second substrates.

According to this embodiment, the flow path can be simply formed in themask. The cooling efficiency of the mask is high since the fluid flowingthrough this flow path comes in contact with the second substrate.

(2) In this method of manufacturing a mask, at least part of the groovemay be formed around the opening.

(3) In this method of manufacturing a mask, the first and secondsubstrates may be joined by anode coupling.

The anode coupling is a method of generating electrostatic force in ajoining interface by voltage application to cause chemical bonding inthe joining interface.

(4) In this method of manufacturing a mask,

-   -   the steps of forming the second substrate may include:    -   forming the penetrating holes in a silicon wafer; and    -   cutting the silicon wafer into a shape corresponding to the        second substrate.

(5) The method of manufacturing a mask may further comprise:

-   -   forming a magnetic film over the second substrate.

This makes it possible to manufacture a mask which can be attracted bymagnetic force.

(6) In this method of manufacturing a mask,

-   -   a plurality of the second substrates may be attached to the        first substrate;    -   the first substrate may have a plurality of the openings; and    -   each of the second substrates may be attached to corresponding        one of the openings.

This makes it possible to form a large-sized mask (in which a pluralityof masks are integrated) can be manufactured.

(7) The method of manufacturing a mask may further comprise:

-   -   polishing surfaces of the second substrates attached to the        first substrate to have a uniform height.

Since the surfaces of the second substrate are flattened, adhesion withan object to which deposition or the like is performed can be improved.

(8) According to one embodiment of the present invention, there isprovided a mask comprising:

-   -   a first substrate having an opening; and    -   a second substrate attached to the first substrate and having a        plurality of penetrating holes, wherein:    -   the second substrate is attached to the first substrate such        that the penetrating holes are positioned within the opening;    -   a groove is formed on at least one of a surface of the first        substrate facing the second substrate and a surface of the        second substrate facing the first substrate; and    -   the groove is utilized to form a flow path between the first and        second substrates.

In accordance with this embodiment, part of the surface of the secondsubstrate is part of the flow path. Accordingly, since the fluid comesin contact with the second substrate, the cooling efficiency of the maskcan be improved.

(9) In this mask, at least part of the groove may be formed around theopening.

(10) In this mask, the first and second substrates may be joined byanode coupling.

The anode coupling is a method of generating electrostatic force in ajoining interface by voltage application to cause chemical bonding inthe joining interface.

(11) In this mask, a magnetic film may be formed over the secondsubstrate.

This makes it possible to attract the second substrate by magneticforce.

(12) In this mask, a plurality of the openings may be formed in thefirst substrate; a plurality of the second substrates may be attached tothe first substrate; and each of the second substrates may be attachedto corresponding one of the openings.

This mask is large-sized by integrating a plurality of masks.

(13) In this mask, surfaces of the second substrates attached to thefirst substrate may be polished to have a uniform height.

Since the surfaces of the second substrates are flattened, adhesion withan object to which deposition or the like is performed can be improved.

(14) According to one embodiment of the present invention, there isprovided a method of manufacturing an EL device comprising:

-   -   forming a film of a light emitting material using the        above-described mask; and    -   cooling the mask by causing a fluid to flow through the flow        path of the mask, in the step of forming a film of a light        emitting material.

(15) An EL device in accordance with one embodiment of the presentinvention is manufactured by the above method.

(16) An electronic instrument according to one embodiment of the presentinvention has the above EL device.

Embodiment of the present invention will be described below withreference to the drawings.

FIGS. 1A and 1B are views for describing a mask in accordance with oneembodiment of the present invention. FIG. 1A is a plan view of the mask,and FIG. 1B is a side view of the mask. FIG. 2 is a partially enlargedsectional view taken along the II—II line of FIG. 1A. FIG. 3 is apartially enlarged sectional view taken along the III—III line of FIG.1A. FIG. 4 is a partially enlarged sectional view taken along the IV—IVline of FIG. 1A. FIG. 5 is an exploded view of the mask.

The mask has a first substrate 10 and at least one (plural in theexample shown in FIG. 1A) second substrate 20. The first substrate 10may be set to a transparent substrate. In this embodiment, the firstsubstrate 10 is constructed by a material (e.g., borosilicate glass)able to be anode-joined to the second substrate 20. At least one (pluralin the example shown in FIG. 1A) opening 12 is formed in the firstsubstrate 10. It can be the that the first substrate 10 is a frame. Theopening 12 is smaller than the second substrate 20. However, the opening12 is greater than a forming area of plural penetrating holes 22 in thesecond substrate 20. The opening 12 may be formed in a rectangularshape.

The second substrate 20 may be also formed in a rectangular shape. Theplural penetrating holes 22 are formed in the second substrate 20. Theshape of the penetrating hole 22 may be set to any one of a squareshape, a parallelogram shape and a circular shape. A mask pattern isconstructed by the shape, arrangement and number of penetrating holes22. It can be the that the second substrate 20 is a screen plate.

The second substrate 20 is attached to the first substrate 10. As shownin FIG. 1A, the second substrate 20 is attached such that the pluralpenetrating holes 22 are arranged inside the opening 12. An end portionof the second substrate 20 is attached to an end portion of the opening12 of the first substrate 10. More particularly, an entire peripheralportion (or a rectangular edge portion) of the second substrate 20 isattached to an entire peripheral portion (or a rectangular edge portion)of the opening of the first substrate 10. One second substrate 20 isarranged in accordance with one opening 12. In this embodiment, thefirst substrate 10 and the second substrate 20 are anode-joined. Thesecond substrate 20 is constructed by a material (e.g., silicon) able tobe anode-joined to the first substrate 10.

A groove 14 (see FIGS. 3 and 4) is formed in the first substrate 10. Thegroove 14 is formed on a surface of the first substrate 10 facing thesecond substrate 20. The groove 14 may be also formed around the opening12. Specifically, the groove 14 may be formed in a ring shape or arectangular shape. For example, plural discontinuous grooves 14 may bealso formed in accordance with the plural openings 12. In this case, theindividual second substrate 20 may be attached to each of the grooves14. The groove 14 may be also formed only within an attaching area ofthe second substrate 20 in the first substrate 10. In this case, a flowpath 18 is formed by the groove 14 and the second substrate 20.

A groove 16 is formed on a surface of the first substrate 10 which isopposite to the other surface facing the second substrate 20. Namely,the first substrate 10 has the groove 14 on one surface, and the groove16 on the other surface. As shown in FIG. 3, the grooves 14, 16 arepartially communicated with each other. The plural discontinuous grooves14 can be communicated through the groove 16.

A third substrate 30 is attached to the first substrate 10. At least one(e.g., plural) penetrating hole 34 is formed in the third substrate 30.The penetrating hole 34 is arranged above part of the groove 16. Thethird substrate 30 is arranged so as to cover the groove 16 except thatthe penetrating hole 34 is formed. The groove 16 may be also coveredwith one third substrate 30. A flow path 28 is formed by the groove 16and the third substrate 30. The penetrating hole 34 becomes an inlet andan outlet with respect to the flow path 28. The plural penetrating holes34 are formed and one of these penetrating holes 34 is set to the inletto the flow path 28, and another of these penetrating holes 34 may beset to the outlet from the flow path 28. The third substrate 30 has ashape in which no opening 12 of the first substrate 10 is covered. Forexample, an opening 32 is formed in the third substrate 30.

In accordance with the mask in this embodiment, the flow path 18 isformed by the groove 14 and the second substrate 20. Since the secondsubstrate 20 itself is part of the flow path 18, the second substrate 20can be effectively cooled when a cooled fluid flows through the flowpath 18. Even when the discontinuous flow path 18 is formed inaccordance with each of the plural discontinuous grooves 14, thediscontinuous flow path 18 can be communicated by the flow path 28. Theflow path 28 is formed by the groove 16 and the third substrate 30. Thefluid can be flowed from the penetrating hole 34 of the third substrate30 to the flow path 28.

The manufacturing method of the mask in accordance with the embodimentof the present invention will next be described. In this embodiment, thefirst substrate 10 and the second substrate 20 are prepared. Sandblastmay be applied to the formation of the opening 12 in the first substrate10.

Plural penetrating holes 22 are formed in the second substrate 20.Etching (e.g., anisotropic etching with a crystal orientationdependence) may be applied to this formation. The wall surface of thepenetrating hole 22 may be set to be perpendicular to the surface of thesecond substrate 20, and may be also tapered. As shown in FIG. 5, thesecond substrate 20 may be formed from a silicon wafer 24. In this case,the silicon wafer 24 may be cut in accordance with the second substrate20.

The first substrate 10 and the second substrate 20 are placed as shownin FIG. 6. The plural second substrates 20 are arranged so as not to beoverlapped with each other. The plural second substrates 20 are arrangedon one side of the first substrate 10. Then the second substrates 20 areattached to the first substrate 10. The first substrate 10 and the thirdsubstrate 30 are positioned. The third substrate is attached to thefirst substrate 10. The positioning and attachment of the firstsubstrate 10 and the second substrate 20, and the positioning andattachment of the first substrate 10 and the third substrate 30 may beperformed sequentially, or simultaneously.

FIG. 7 shows an example of the method of attaching the first substrate10 and the second substrate 20. In this embodiment, the anode couplingis applied. More particularly, The first substrate 10 and the secondsubstrate 20 are placed such that the surfaces to be attached face eachother, and are heated to about 300 to 500° C., and then a voltage ofabout 500 V is applied. When the first substrate 10 is formed ofborosilicate glass (e.g., Corning #7740 (Pyrex® glass)) and the secondsubstrate 20 is formed of silicon, the first substrate 10 is connectedto the negative pole. Thus, a plus ion (sodium ion) of the firstsubstrate 10 is moved toward the minus, and the surface of the firstsubstrate 10 facing the second substrate 20 is charged to the negativepole. On the other hand, the surface of the second substrate 20 facingthe first substrate 10 is charged to the plus. Thus, the first substrate10 and the second substrate 20 are attracted to each other byelectrostatic force, and chemical bonding is caused so that the firstsubstrate 10 and the second substrate 20 are joined to each other.

The coefficient of thermal expansion of the Corning #7740 (Pyrex® glass)constituting the first substrate 10 is about 3.5 ppm/° C., and is closeto the coefficient of thermal expansion of silicon constituting thesecond substrate 20. Accordingly, even when the mask is used under hightemperature, a warp and a strain are small so that the warp and thestrain can be neglected. Since no adhesive is used in accordance withthe anode coupling, there is no strain due to hardening contraction andno gas is emitted. Thus, the mask in accordance with this embodiment isoptimal for evaporation in a high vacuum.

The attaching method of the above first substrate 10 and the abovesecond substrate 20 may be also applied to the attachment of the firstsubstrate 10 and the third substrate 30. In accordance with thisembodiment, the flow path 18 is formed by the groove 14 and the secondsubstrate 20. The second substrate 20 forms part of the flow path 18.Since the second substrate 20 is reinforced by the first substrate 10, amask having large strength can be manufactured.

The present invention does not exclude the joining using the adhesive.For example, the first substrate 10 and the second substrate 20, or thefirst substrate 10 and the third substrate 30 may be also adhered by theadhesive. The adhesive 30 may be set to an energy hardening adhesive.The energy includes light (an ultraviolet ray, an infrared ray andvisible light), radiation such as an X-ray, etc. and heat.

As shown in FIG. 8, when the plural second substrates 20 are notuniformed in height because the plural second substrates 20 aredispersed in thickness, etc., the surfaces of the second substrates 20may be polished by a grindstone 40, etc. In accordance with thisconfiguration, since the surfaces of the plural second substrates 20 areflattened, it is possible to raise close attaching property to an objectto be evaporated, etc.

FIGS. 9A and 9B are views showing a modification of one embodiment ofthe present invention. Although the groove 14 is formed in the firstsubstrate 10 in the above embodiment, a groove 44 may be formed in asecond substrate 42, as shown in FIG. 9A. Alternatively, the groove 14may be formed in the first substrate 10, the groove 44 in the secondsubstrate 42, to face each other and form a flow path, as shown in FIG.9B.

FIG. 10 is a view for describing the manufacturing method of a mask andan EL device in accordance with one embodiment of the present invention.A magnetic film 52 is formed in a mask 50 (e.g., second substrate 20)shown in FIG. 10. The magnetic film 52 can be formed by a ferromagneticmaterial such as iron, cobalt, nickel, etc. Otherwise, the magnetic film52 may be also formed by a magnetic metal material such as Ni, Co, Fe, astainless steel alloy including an Fe component, etc., the bonding ofthe magnetic metal material and a nonmagnetic metal material.

In this embodiment, the light emitting material is formed as a film inthe substrate 54 by using the mask 50. The substrate 54 is arranged toform plural EL devices (e.g., organic EL devices) and is a transparentsubstrate such as a glass substrate, etc. As shown in FIG. 11A, anelectrode (e.g., a transparent electrode constructed by ITO, etc.) 56and a positive hole transport layer 58 are formed in the substrate 54.An electronic transport layer may be also formed.

As shown in FIG. 10, the mask 50 is arranged such that the secondsubstrate 20 is located on the substrate 54 side. A magnet 48 isarranged behind the substrate 54 so as to attract the magnetic film 52formed in the mask 50 (second substrate 20). Thus, even when a warp iscaused in the mask 50 (second substrate 20), this warp can be corrected.

FIGS. 11A to 11C are views for describing a method of forming a film ofa light emitting material. For example, the light emitting material isan organic material, and there is alumiquinolinol complex (Alq₃) as theorganic material of low molecule, and there is poly(p-phenylenevinylene)(PPV) as the organic material of high molecule. The film of the lightemitting material can be formed by evaporation. For example, as shown inFIG. 11A, while a red light emitting material is patterned through themask 50, the film is formed and a red light emitting layer 60 is formed.As shown in FIG. 11B, while the mask 50 is shifted and a green lightemitting material is patterned, the film is formed and a green lightemitting layer 62 is formed. As shown in FIG. 11C, while the mask 50 isagain shifted and a blue light emitting material is patterned, the filmis formed and a blue light emitting layer 62 is formed.

In this embodiment, the above flow path 18 is formed in the mask 50. Thefilm of the light emitting material is formed while a cooled fluid flowsthrough the flow path 18. Thus, the mask 50 can be effectively cooled.In this embodiment, the second substrate 20 as a screen is reinforced bythe first substrate 10. Accordingly, the warp and the flexure of thesecond substrate 20 are not caused, and the reproducibility of selectiveevaporation is high and productivity is high. In this embodiment, pluralopenings 12 are formed in the first substrate 10 in the mask 50, and thesecond substrate 20 is located in accordance with each of the openings12. Each second substrate 20 corresponds to one EL device. Namely, theintegrated plural EL devices can be manufactured by using the mask 50.The individual EL device can be obtained by cutting the substrate 54.

FIG. 12 is a view showing an EL device manufactured by utilizing theabove method of forming a film of a light emitting material. The ELdevice (e.g., organic EL device) has a substrate 54, an electrode 56, apositive hole transport layer 58, light emitting layers 60, 62, 64, etc.An electrode 66 is formed on the light emitting layers 60, 62, 64. Forexample, the electrode 66 is a cathode electrode. The EL device (ELpanel) becomes a display device (display).

A notebook personal computer 1000 is shown in FIG. 13 and a portabletelephone 2000 is shown in FIG. 14 as an electronic instrument having anEL device in accordance with one embodiment of the present invention.

The present invention is not limited to the above-described embodiments,and various modifications can be made. For example, the presentinvention includes various other configurations substantially the sameas the configurations described in the embodiments (in function, methodand effect, or in objective and effect, for example). The presentinvention also includes a configuration in which an unsubstantialportion in the described embodiments is replaced. The present inventionalso includes a configuration having the same effects as theconfigurations described in the embodiments, or a configuration able toachieve the same objective. Further, the present invention includes aconfiguration in which a publicly known technique is added to theconfigurations in the embodiments.

1. A method of manufacturing a mask comprising: attaching to a framehaving an opening a screen plate having a plurality of penetrating holesarranged to form a mask pattern such that the penetrating holes arepositioned within the opening, the penetrating holes set toperpendicularly connect holes formed in opposite surfaces of the screenplate; forming a groove on at least one of a surface of the frame facingthe screen plate and a surface of the screen plate facing the frame; andutilizing the groove to form a flow path between the frame and thescreen plate.
 2. The manufacturing method of the mask as defined inclaim 1, wherein at least part of the groove is formed around theopening.
 3. The manufacturing method of the mask as defined in claim 1,wherein the frame and the screen plate are joined by anode coupling. 4.The manufacturing method of the mask as defined in claim 2, wherein theframe and the screen plate are joined by anode coupling.
 5. Themanufacturing method of the mask as defined in claim 1, wherein thesteps of forming the screen plate includes: forming the penetratingholes in a silicon wafer; and cutting the silicon wafer into a shapecorresponding to the screen plate.
 6. The manufacturing method of themask as defined in claim 1, further comprising: forming a magnetic filmover the screen plate.
 7. The manufacturing method of the mask asdefined in claim 1, wherein: a plurality of the screen plates areattached to the frame; the frame has a plurality of the openings; andeach of the screen plates is attached to corresponding one of theopenings.
 8. The manufacturing method of the mask as defined in claim 7,further comprising: polishing surfaces of the screen plates attached tothe frame to have a uniform height.
 9. A mask comprising: a frame havingan opening; and a screen plate attached to the frame and having aplurality of penetrating holes arranged to form a mask pattern, thepenetrating holes set to perpendicularly connect holes formed inopposite surfaces of the screen plate, wherein: the screen plate isattached to the frame such that the penetrating holes are positionedwithin the opening; a groove is formed on at least one of a surface ofthe frame facing the screen plate and a surface of the screen platefacing the frame; and the groove is utilized to form a flow path betweenthe frame and the screen plate.
 10. The mask as defined in claim 9,wherein at least part of the groove is formed around the opening. 11.The mask as defined in claim 9, wherein the frame and the screen plateare joined by anode coupling.
 12. The mask as defined in claim 10,wherein the frame and the screen plate are joined by anode coupling. 13.The mask as defined in claim 9, wherein a magnetic film is formed overthe screen plate.
 14. The mask as defined in claim 9, wherein: aplurality of the openings are formed in the frame; a plurality of thescreen plates are attached to the frame; and each of the screen platesis attached to corresponding one of the openings.
 15. The mask asdefined in claim 14, wherein surfaces of the screen plates attached tothe frame are polished to have a uniform height.
 16. A method ofmanufacturing an electro-luminescence device comprising: forming a filmof a light emitting material using the mask as defined in claim 9; andcooling the mask by causing a fluid to flow through the flow path of themask, in the step of forming a film of a light emitting material.
 17. Amethod of manufacturing an electro-luminescence device comprising:forming a film of a light emitting material using the mask as defined inclaim 10; and cooling the mask by causing a fluid to flow through theflow path of the mask, in the step of forming a film of a light emittingmaterial.
 18. A method of manufacturing an electro-luminescence devicecomprising: forming a film of a light emitting material using the maskas defined in claim 11; and cooling the mask by causing a fluid to flowthrough the flow path of the mask, in the step of forming a film of alight emitting material.
 19. A method of manufacturing anelectro-luminescence device comprising: forming a film of a lightemitting material using the mask as defined in claim 12; and cooling themask by causing a fluid to flow through the flow path of the mask, inthe step of forming a film of a light emitting material.
 20. A method ofmanufacturing a mask comprising: attaching to a frame having an openinga screen plate having a plurality of penetrating holes arranged to forma mask pattern such that the penetrating holes are positioned within theopening, the penetrating holes set to be tapered; forming a groove on atleast one of a surface of the frame facing the screen plate and asurface of the screen plate facing the frame; and utilizing the grooveto form a flow path between the frame and the screen plate.
 21. Themanufacturing method of the mask as defined in claim 20, wherein atleast part of the groove is formed around the opening.
 22. Themanufacturing method of the mask as defined in claim 20, wherein theframe and the screen plate are joined by anode coupling.
 23. Themanufacturing method of the mask as defined in claim 21, wherein theframe and the screen plate are joined by anode coupling.
 24. Themanufacturing method of the mask as defined in claim 20, wherein thesteps of forming the screen plate includes: forming the penetratingholes in a silicon wafer; and cutting the silicon wafer into a shapecorresponding to the screen plate.
 25. The manufacturing method of themask as defined in claim 20, further comprising: forming a magnetic filmover the screen plate.
 26. The manufacturing method of the mask asdefined in claim 20, wherein: a plurality of the screen plates areattached to the frame; the frame has a plurality of the openings; andeach of the screen plates is attached to corresponding one of theopenings.
 27. The manufacturing method of the mask as defined in claim26, further comprising: polishing surfaces of the screen plates attachedto the frame to have a uniform height.
 28. A mask comprising: a framehaving an opening; and a screen plate attached to the frame and having aplurality of penetrating holes arranged to form a mask pattern, thepenetrating holes set to be tapered, wherein: the screen plate isattached to the frame such that the penetrating holes are positionedwithin the opening; a groove is formed on at least one of a surface ofthe frame facing the screen plate and a surface of the screen platefacing the frame; and the groove is utilized to form a flow path betweenthe frame and the screen plate.
 29. The mask as defined in claim 28,wherein at least part of the groove is formed around the opening. 30.The mask as defined in claim 28, wherein the frame and the screen plateare joined by anode coupling.
 31. The mask as defined in claim 29,wherein the frame and the screen plate are joined by anode coupling. 32.The mask as defined in claim 28, wherein a magnetic film is formed overthe screen plate.
 33. The mask as defined in claim 28, wherein: aplurality of the openings are formed in the frame; a plurality of thescreen plates are attached to the frame; and each of the screen platesis attached to corresponding one of the openings.
 34. The mask asdefined in claim 33, wherein surfaces of the screen plates attached tothe frame are polished to have a uniform height.
 35. A method ofmanufacturing an electro-luminescence device comprising: forming a filmof a light emitting material using the mask as defined in claim 28; andcooling the mask by causing a fluid to flow through the flow path of themask, in the step of forming a film of a light emitting material.
 36. Amethod of manufacturing an electro-luminescence device comprising:forming a film of a light emitting material using the mask as defined inclaim 29; and cooling the mask by causing a fluid to flow through theflow path of the mask, in the step of forming a film of a light emittingmaterial.
 37. A method of manufacturing an electro-luminescence devicecomprising: forming a film of a light emitting material using the maskas defined in claim 30; and cooling the mask by causing a fluid to flowthrough the flow path of the mask, in the step of forming a film of alight emitting material.
 38. A method of manufacturing anelectro-luminescence device comprising: forming a film of a lightemitting material using the mask as defined in claim 31; and cooling themask by causing a fluid to flow through the flow path of the mask, inthe step of forming a film of a light emitting material.